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| SPD30N03S2L-10 OptiMOS(R) Power-Transistor Feature * N-Channel Product Summary VDS R DS(on) ID 30 10 30 P- TO252 -3-11 V m A * Enhancement mode * Logic Level * Low On-Resistance R DS(on) * Excellent Gate Charge x R DS(on) product (FOM) * Superior thermal resistance * 175C operating temperature * Avalanche rated * dv/dt rated Type SPD30N03S2L-10 Package Ordering Code P- TO252 -3-11 Q67042-S4030 Marking 2N03L10 Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Continuous drain current1) TC=25C Symbol ID Value 30 30 Unit A Pulsed drain current TC=25C ID puls EAS EAR dv/dt VGS Ptot T j , Tstg 120 150 10 6 20 100 -55... +175 55/175/56 kV/s V W C mJ Avalanche energy, single pulse ID=30 A , V DD=25V, RGS=25 Repetitive avalanche energy, limited by Tjmax 2) Reverse diode dv/dt IS=30A, VDS=24V, di/dt=200A/s, T jmax=175C Gate source voltage Power dissipation TC=25C Operating and storage temperature IEC climatic category; DIN IEC 68-1 Page 1 2003-04-24 SPD30N03S2L-10 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 3) Symbol min. RthJC RthJA RthJA - Values typ. 1 max. 1.5 100 75 50 Unit K/W Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage V GS=0V, ID=1mA Symbol min. V(BR)DSS VGS(th) IDSS IGSS RDS(on) RDS(on) 30 1.2 Values typ. 1.6 max. 2 Unit V Gate threshold voltage, VGS = V DS ID=50A Zero gate voltage drain current V DS=30V, VGS=0V, Tj=25C V DS=30V, VGS=0V, Tj=125C A 0.01 10 1 11.2 7.8 1 100 100 14.6 10 nA m Gate-source leakage current V GS=20V, VDS=0V Drain-source on-state resistance V GS=4.5V, I D=30A Drain-source on-state resistance V GS=10V, I D=30 1Current limited by bondwire ; with an RthJC = 1.5K/W the chip is able to carry ID= 76A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2 2003-04-24 SPD30N03S2L-10 Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg VDD =24V, ID =30A, VGS =0 to 10V VDD =24V, ID =30A Symbol Conditions min. Values typ. 47.5 1160 450 120 6.1 13 27 17 max. - Unit gfs Ciss Coss Crss td(on) tr td(off) tf VDS 2*ID *RDS(on)max, ID =30A VGS =0V, VDS =25V, f=1MHz 23.8 - S 1550 pF 600 175 9.2 20 41 26 ns VDD =15V, VGS =10V, ID =30A, RG =5.4 - 3.7 10.9 31.4 3.4 4.9 16.3 41.8 - nC V(plateau) VDD =24V, ID =30A V Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr V GS=0V, IF=30A V R=-V, IF=lS, diF/dt=100A/s IS TC=25C - 0.9 31 29 30 120 1.2 39 37 A V ns nC Page 3 2003-04-24 SPD30N03S2L-10 1 Power dissipation Ptot = f (TC) parameter: VGS 4 V 110 SPD30N03S2L-10 2 Drain current ID = f (T C) parameter: VGS 10 V 32 SPD30N03S2L-10 W 90 80 A 24 P tot ID 100 120 140 160 C 190 70 60 20 16 50 40 30 20 4 10 0 0 20 40 60 80 0 0 20 40 60 80 12 8 100 120 140 160 C 190 TC TC 3 Safe operating area ID = f ( VDS ) parameter : D = 0 , TC = 25 C 10 3 SPD30N03S2L-10 4 Max. transient thermal impedance Z thJC = f (t p) parameter : D = t p/T 10 1 SPD30N03S2L-10 K/W A 10 /I D 0 t = 10.0s p ID V DS 10 2 Z thJC 100 s 10 R DS (on ) = -1 D = 0.50 10 10 1 1 ms -2 0.20 0.10 single pulse 0.05 0.02 0.01 10 -3 10 0 10 -1 10 0 10 1 V 10 2 10 -4 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 VDS Page 4 tp 2003-04-24 SPD30N03S2L-10 5 Typ. output characteristic ID = f (V DS); T j=25C parameter: tp = 80 s SPD30N03S2L-10 6 Typ. drain-source on resistance RDS(on) = f (I D) parameter: VGS 32 SPD30N03S2L-10 75 A Ptot = 100W V [V] GS a b c m fe d b c 60 55 50 c 3.0 3.5 4.0 4.5 5.0 5.5 d e f R DS(on) 24 ID 45 40 35 30 25 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 a b 20 16 12 d e 8 f 4 VGS [V] = b 3.5 c 4.0 d 4.5 e 5.0 f 5.5 4 V 0 5 0 10 20 30 40 A 60 VDS ID 7 Typ. transfer characteristics ID= f ( V GS ); V DS 2 x ID x RDS(on)max parameter: tp = 80 s 60 8 Typ. forward transconductance g fs = f(I D); T j=25C parameter: g fs 60 A 50 45 S 50 45 35 30 25 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 g fs V5 VGS ID 40 40 35 30 25 20 15 10 5 0 0 10 20 30 40 A ID 60 Page 5 2003-04-24 SPD30N03S2L-10 9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 30 , VGS = 10 V 24 SPD30N03S2L-10 10 Typ. gate threshold voltage VGS(th) = f (T j) parameter: VGS = VDS 2.5 m 20 V V GS(th) 0,4mA R DS(on) 18 16 14 12 10 8 6 typ 98% 1.5 50A 1 0.5 4 2 0 -60 -20 20 60 100 140 C 200 0 -60 -20 20 60 100 C Tj 180 Tj 11 Typ. capacitances C = f (V DS) parameter: VGS=0V, f=1 MHz 10 4 12 Forward character. of reverse diode IF = f (V SD) parameter: T j , tp = 80 s 10 3 SPD30N03S2L-10 A pF 10 2 10 3 Coss 10 1 IF C Ciss T j = 25 C typ T j = 175 C typ Crss T j = 25 C (98%) T j = 175 C (98%) 10 2 10 5 10 15 20 0 0 V 30 0 0.4 0.8 1.2 1.6 2 2.4 V 3 V DS VSD Page 6 2003-04-24 SPD30N03S2L-10 13 Typ. avalanche energy E AS = f (T j) par.: I D = 30 A , V DD = 25 V, R GS = 25 160 14 Typ. gate charge VGS = f (QGate) parameter: ID = 30 A pulsed 16 SPD30N03S2L-10 mJ V 120 12 E AS 100 VGS 10 0,2 VDS max 0,8 VDS max 80 8 60 6 40 4 20 2 0 25 45 65 85 105 125 145 C 185 Tj 0 0 5 10 15 20 25 30 35 40 nC 50 QGate 15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA 36 SPD30N03S2L-10 V V(BR)DSS 34 33 32 31 30 29 28 27 -60 -20 20 60 100 140 C 200 Tj Page 7 2003-04-24 SPD30N03S2L-10 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Further information Please notice that the part number is BSPD30N03S2L-10, for simplicity the device is referred to by the term SPD30N03S2L-10 throughout this documentation. Page 8 2003-04-24 |
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